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Louis Manzione was named dean of the University of Hartford’s College of Engineering, Technology, and Architecture (CETA) by President Walter Harrison and Provost Donna Randall on May 13, 2005 and assumed his new position on August 22.  Prior to that, he was founding executive director of Bell Laboratories research center in Ireland.

At Bell Labs Ireland, Manzione developed a multidisciplinary research program and funding proposals for a new Bell Labs Research Center in Ireland focused on next generation manufacturing and supply chain technologies.   As part of this research program, he created a partnership with nearly 100 academic researchers from nine Irish universities, known as the Center for Telecommunications Value Chain Research.  The new lab has grown to become an important part of the Bell Labs effort and is a model of effective industry-academic-government partnership.

Manzione is recognized as a pioneer in the packaging of integrated circuits. He wrote the first book on plastic molded packaging of computer chips and such packaging is now used in more than 90 percent of the world’s integrated circuits. In recognition of his achievements, Manzione was named a Fellow of the Society of Plastics Engineers for career achievement in the use of plastics for electronics.  At Bell Labs, he served on the President’s Leadership Team and the Strategic Planning Committee.  Dean Manzione was on several of the design teams for early generations of Cell Phones, and his work on next generation antennas has garnered considerable attention and several patents.

Manzione received his bachelor’s degree in chemical engineering from The Cooper Union in New York, and his Ph.D. in chemical engineering from Princeton University.  From 1990-2005, he was a member of the Advisory Council of the New Jersey Institute of Technology, as well as other academic advisory boards for shorter tenures. He was appointed Research Professor at Trinity College Dublin as part of his role in Bell Labs Ireland.

He has published over 30 journal articles, holds 17 US patents, and has been awarded four Best Paper Awards. He has extensive experience in commercialization and technology transfer, and has seen millions of products produced from his patents worldwide. He has two books; an edited volume “Applications of Computer Aided Engineering in Injection Molding”, and a sole authored volume “Plastic Packaging of Microelectronic Devices.”

Since arriving in Connecticut, Dean Manzione has played a role in the technological and economic vitality of the region.  He served as President of the Connecticut Academy of Science and Engineering (2012-2014), a body of the top scientists and engineers in the state that provides support and insight to state agencies and the legislature. In addition, he has served as the Chair of the Nanotechnology Curriculum Committee (2007-2009), where he led a group of the state’s leading faculty in developing a shared curriculum on this emerging technology.  Recently he was named as the Chair of the Connecticut Engineering Deans Council, a body that works with the State agencies and Governor Malloy’s initiative on job creation.  At the University of Hartford, he regularly teaches an Honors Seminar Course that he uses to help students understand what it takes to excel in the engineering profession. He also coaches students on patents and entrepreneurism.